Spray towerTo importPPThe board is the main material used for design and production, and the internal spray layer is filled with materialPPPolypropylene material Raschig ring, based on the principle that the gas absorption process occurs at the gas-liquid interface and the transfer rate is proportional to the interface area, uses fillers to increase the contact area between the two phases, allowing them to be fully dispersed and achieving the purpose of waste gas treatment.

Structural characteristics of spray tower:

The acid mist spray tower can be designed in two types based on customer space management and other factors: vertical and horizontal. The working principle of the vertical structure is gas-liquid two-phase vertical reverse contact, while the working principle of the horizontal structure is gas-liquid two-phase bifurcation contact. The exhaust gas is absorbed and neutralized through the liquid phase contact of the packing layer, thus achieving the effect of exhaust gas purification. The packing layer in a single tower can be divided into single or multiple layers.

Advantages of Spray Tower:

Equipment removal efficiency is as high as97%It has the advantages of good performance, strong corrosion resistance, light weight, easy installation and maintenance, high strength, beautiful appearance, small footprint, and low operation and maintenance costs in the later stage.

Spray tower parameters:

1Pressure loss:<390-780pa.

2Applicable temperature:PPThe material is-10℃-120℃.

3Vertical tower specifications and processing capacity:φ300-φ5000mm, exhaust gas treatment capacity1000m3/h—100,000m3/h.

4The specifications of the horizontal tower are designed according to the amount of exhaust gas that the customer needs to treat.

Spray towerUse case:

Huakang Environmental Protection installs spray towers for metallurgical plants

Scope of application of spray tower:Suitable for the absorption, washing, or purification of waste gases generated by production processes in industries such as chemical, petroleum, semiconductor, pharmaceutical, food, printing, metallurgy, laboratory, and electroplating.